0.5mm PCB Lamination Steel Plate SUS301H | Ra≤0.15μm Surface | 450HRC Hardness for CCL Manufacturing
The ESSP-S301 PCB Lamination Steel Plate is engineered for precision circuit board manufacturing, featuring 0.5mm thickness and exceptional corrosion resistance. Manufactured using high-quality SUS301H steel from Japan, this press plate delivers reliable performance in demanding electronic production environments.
- Precision Surface Finish: Ra≤0.15μm / Rz≤1.5μm surface roughness
- High Strength Material: SUS301H Japanese steel with ≥1175 N/mm² yield strength
- Thermal Performance: ≥15W/MK thermal conductivity at 300℃
- Corrosion Resistance: Enhanced durability for long-term reliability
- Temperature Tolerance: Operating temperature up to 280℃
- Multiple Thickness Options: Available in 0.5mm, 1.0mm, and 1.2mm
| Parameter | Specification |
|---|---|
| Thickness Tolerance | ±0.10mm |
| Hardness | ≥450 HRC |
| Surface Roughness | Ra≤0.14μm / Rz≤1.50μm |
| Thermal Conductivity | ≥15W/MK at 300℃ |
| Working Temperature | ≤280℃ |
| Steel Material | SUS301H (Japan) |
| Yield Strength | ≥1175 N/mm² |
Thinner 0.5mm design enables increased lamination layers and improved temperature uniformity during the PCB manufacturing process.
Ideal for copper clad laminate (CCL) pressing in PCB manufacturing, compatible with various lamination steel plate washing machines, and suitable for industrial electronic production facilities.
Minimum Order Quantity: 100 pieces
Delivery Time: 10-20 days after advance payment
Packaging: Secure plywood crates with protective materials for safe international shipping
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