0.075mm Polyester Laminating Release Film for FPC Circuit Board Lamination with 10-35gf/inch Release Force
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
ES
Product Description
0.075mm Polyester Laminating Release Film for FPC Lamination
This specialized release film is engineered specifically for flexible printed circuit board (FPC) lamination processes. Also known as FPC release film or F-PCB lamination release film, it serves as a functional component during FPC manufacturing.
Application
The FPC release film functions as a covering film during FPC or F-PCB lamination processes. It provides essential isolation and separation functions while also facilitating false bonding and compression of EML and FR4 materials.
Product Structure
- Release layer
- High-temperature resistant PET substrate
- Release layer
Key Features
- Double matte surfaces for enhanced production operation efficiency
- Minimal surface static electricity to prevent dust and foreign object adsorption
- Low silicone oil transfer to minimize contamination risks
Product Specifications
| Model | Thickness | Release Force | Surface Finish |
|---|---|---|---|
| ESRF1-25 | 25μm | 10-35gf/inch | Matte glossy |
| ESRF1-36 | 36μm | - | - |
| ESRF1-50 | 50μm | - | - |
| ESRF1-75 | 75μm | - | - |
| ESRF1-100 | 100μm | - | - |
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Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin