FPC Release Film for Flexible Circuit Board Lamination - 25μm to 100μm Thickness with 10-35gf/inch Release Force
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
ES
Product Description
FPC Release Film for Flexible Circuit Board Lamination
Specialized release film designed specifically for flexible printed circuit board (FPC) lamination processes, providing essential isolation and separation functions during manufacturing.
Product Application
This FPC release film serves as a covering layer during FPC lamination, functioning as an isolation and separation medium. It is also utilized for false bonding and compression applications involving EML and FR4 materials.
Product Structure
- Release layer
- High-temperature resistant PET substrate
- Release layer
Key Features
- Double matte surfaces for enhanced production handling and operation
- Minimal surface static electricity to prevent dust and foreign object adsorption
- Low silicone oil transfer to reduce contamination risks
Product Specifications
| Model | Thickness | Release Force | Surface Finish |
|---|---|---|---|
| ESRF1-25 | 25μm | 10-35gf/inch | Matte glossy |
| ESRF1-36 | 36μm | - | - |
| ESRF1-50 | 50μm | - | - |
| ESRF1-75 | 75μm | - | - |
| ESRF1-100 | 100μm | - | - |
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Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin