Dura420 SUS420J2 Stainless Steel Wafer Dicing Ring HRC48-55 with 1.2mm Thickness for Semiconductor Processing
Professional stainless steel wafer frame ring with HRC48-55 surface hardness for semiconductor manufacturing applications.
EASTAR® wafer frame rings (also known as Wafer Dicing Rings, Wafer Metal Frames, or Wafer Ring Frames) are precision-engineered components designed by EASTAR's engineering team. These rings provide ergonomic support and protection during wafer and chip shipping, handling, and processing operations.
| Parameter | Specification |
|---|---|
| Material | Dura420/SUS420J2 Stainless Steel |
| Surface Hardness | HRC48-55 |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness Level | <0.2mm |
| Size | External Diameter | Inner Diameter | Thickness |
|---|---|---|---|
| 06 inches | Φ228mm | Φ194mm | 1.2mm |
| 08 inches | Φ276mm | Φ250mm | 1.2mm |
| 12 inches | Φ400mm | Φ350mm | 1.5mm |
- Mechanical Polishing
- Glossy Surface: Ra <0.15μm
- Matte Surface: Ra >0.3μm
- Mirror Surface: Ra <0.05μm
EASTAR® wafer frame rings serve as circular or custom-shaped metal rings that protect wafer and chip edges during laser marking processes. They provide essential protection and positioning limits, withstanding high temperatures and energy during UV laser marking to prevent chip damage and edge fragmentation.
Available in inner circular shape, inner square shape, and special customized shapes. All dimensions and configurations can be customized according to customer specifications and drawings.
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