HRC48-55 Wafer Dicing Frame Ring with Mechanical Polishing Ra <0.15μm in 6", 8", 12" Sizes
Price:
negotiable
MOQ:
100pcs
Delivery Time:
7-10days after receiving prepayment
Brand:
EastStar
Product Description
HRC48-55 Wafer Dicing Frame Ring with Mechanical Polishing
Product Overview
The ES-WFR-Dura420 wafer dicing frame ring is manufactured from German Dura420 high-hardness stainless steel, providing exceptional performance for semiconductor wafer processing applications. This precision component ensures reliable support during wafer and chip handling, shipping, and processing operations.
Key Specifications
| Parameter | Specification |
|---|---|
| Material | German Dura420 Stainless Steel |
| Surface Hardness | HRC48-55 |
| Surface Finish | Mechanical Polishing (Ra <0.15μm), Matte (Ra >0.3μm), Mirror (Ra <0.05μm) |
| Available Sizes |
6-inch: Φ228mm OD / Φ194mm ID / 1.2mm thickness 8-inch: Φ276mm OD / Φ250mm ID / 1.2mm thickness 12-inch: Φ400mm OD / Φ350mm ID / 1.5mm thickness |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness | <0.2mm |
| Available Shapes | Inner circular, inner square, and custom shapes per customer specifications |
Primary Applications
- Wafer edge protection during laser marking processes
- Chip positioning and alignment in semiconductor manufacturing
- High-temperature UV laser marking operations
- Wafer and chip shipping and handling support
Product Images
Customization Options
All shapes, sizes, and surface treatments can be customized according to customer drawings and specifications, ensuring optimal compatibility with your semiconductor manufacturing processes.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin