36μm to 100μm PET Substrate Release Film for Rigid PCB Lamination - ESRF2 Series with High-Temperature Resistance
Price:
negotiable
MOQ:
200pcs
Delivery Time:
around 10-15 days
Brand:
EastStar
Product Description
PET Substrate Release Film for Rigid PCB Lamination
Product Overview
Specialized 36μm to 100μm thick PET substrate release film designed specifically for rigid printed circuit board (R-PCB) lamination processes. This functional release film provides reliable isolation and separation during PCB manufacturing.
Technical Specifications
| Model | Thickness | Release Force | Surface Finish |
|---|---|---|---|
| ESRF2-25 | 25μm | 10-35gf/inch | Matte glossy |
| ESRF2-36 | 36μm | - | - |
| ESRF2-50 | 50μm | - | - |
| ESRF2-75 | 75μm | - | - |
| ESRF2-100 | 100μm | - | - |
Applications
Ideal for rigid PCB lamination processes including:
- PCB blind hole board lamination
- Slotted board manufacturing
- Back panel production
- General R-PCB lamination operations
Product Structure
Three-layer construction:
- Release layer
- High-temperature resistant PET substrate
- Release layer
Key Features
- Double matte surfaces for easier production handling
- Low static electricity minimizes dust and foreign object adsorption
- Reduced silicone oil transfer for lower contamination risk
- Superior high-temperature resistance for higher lamination temperatures
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin