228mm Yellow Wafer Frame Ring SUS420J2 Stainless Steel with HRC48-55 Hardness for Semiconductor Protection
Price:
negotiable
MOQ:
200pcs
Delivery Time:
20days after receiving prepayment
Brand:
ES
Product Description
EASTAR® Wafer Frame Ring Overview
EASTAR® wafer frame rings (also known as Wafer Dicing Rings, Wafer Metal Frames, or Wafer Ring Frames) are precision-engineered circular metal rings designed to protect wafer and chip edges during laser marking processes. These rings provide essential protection and positioning limits while withstanding high temperatures and energy levels during UV laser operations.
Key Features & Benefits
- Ergonomic design for safe wafer and chip shipping and handling operations
- Extremely lightweight construction with reliable shaping performance
- High temperature resistance during UV laser marking processes
- Prevents chip damage and edge fragmentation
- Trusted by wafer producers globally
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | Dura420/SUS420J2 Stainless Steel |
| Surface Hardness | HRC48-55 |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness Level | <0.2mm |
| Surface Treatment | Mechanical Polishing: Glossy surface Ra<0.15μm, Matte surface Ra>0.3μm, Mirror surface Ra<0.05μm |
Available Sizes
| Size | External Diameter | Inner Diameter | Thickness |
|---|---|---|---|
| 06 inches | Φ228mm | Φ194mm | 1.2mm |
| 08 inches | Φ276mm | Φ250mm | 1.2mm |
| 12 inches | Φ400mm | Φ350mm | 1.5mm |
Customization Options
EASTAR® offers flexible customization for wafer frame rings, including inner circular shapes, inner square shapes, and special customized geometries. All shapes and sizes can be tailored according to customer specifications and technical drawings.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin