1.0-2.5mm Copper Clad Laminate Steel Plate NAS630 with ≤3mm/M Warpage and 50 HRC Hardness for CCL Manufacturing
ESSP-CCL-400 Copper Clad Laminate Steel Plate is a high-precision lamination steel plate specifically engineered for copper clad laminate (CCL) manufacturing processes. Manufactured using premium Japanese metallurgical standards, these plates deliver exceptional performance in CCL production applications.
| Parameter | NAS630 Japan | NAS301 Japan |
|---|---|---|
| Thickness Range | 1.0-2.5mm | 1.0-1.8mm |
| Maximum Dimensions | 2410mm × 1300mm | 3150mm × 1060mm |
| Thickness Tolerance | ±0.05mm | ±0.05mm |
| Surface Roughness | Ra ≤ 0.15μm, Rz ≤ 1.5μm | Ra ≤ 0.15μm, Rz ≤ 1.5μm |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥520 N/mm² |
| Hardness | 50 HRC ±2 | 44 HRC ±2 |
| Thermal Conductivity | ≥25 W/MK at 300℃ | ≥18 W/MK at 300℃ |
| Working Temperature | ≤400℃ | ≤400℃ |
Manufactured using highest-grade Japanese steel with advanced heat treatment and grinding processes for reliable lamination performance.
Features ≤3mm/M warpage degree at high temperatures with extended 8-10 year service life.
Excellent thermal conductivity (≥25 W/MK) and optimized thermal expansion coefficient for consistent performance.
Exceptional corrosion resistance and hardness (50 HRC) ensures long-term reliability.
Specifically designed for copper clad laminate (CCL) manufacturing in printed circuit board production. These steel plates serve as essential components in CCL laminating processes, providing interconnection, insulation, and support functions critical to PCB performance.
Compatible with various CCL laminators including BURKLE, LAUFFER, CEDAL, HELD, DATIAN, WEIDI, and DIPUER systems.
Available in conventional dimensions: 2220×1270mm, 2210×1270mm, 1910×1270mm, 1500×1295mm, 1300×800mm, 1295×787mm, 1295×1613mm, 1295×1143mm
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.