NAS630 NAS301 PCB Lamination Steel Plate 1.6-2.0mm Thickness 1500×1295mm for Electronics Manufacturing
The ESSP-PCB-400 is a high-precision lamination steel plate specifically designed for PCB manufacturing processes. Manufactured using premium Japanese NAS630 and NAS301 materials, these plates deliver exceptional performance in PCB laminators with reliable thermal conductivity and minimal warpage.
| Parameter | NAS630 Japan | NAS301 Japan |
|---|---|---|
| Thickness Range | 1.0-2.5mm | 1.0-1.8mm |
| Maximum Width | ≤1300mm | ≤1060mm |
| Maximum Length | ≤2410mm | ≤3150mm |
| Thickness Tolerance | ±0.05mm | ±0.05mm |
| Surface Roughness | Ra≤0.15μm Rz≤1.5μm | Ra≤0.15μm Rz≤1.5μm |
| Tensile Strength | ≥1400 N/mm² | ≥520 N/mm² |
| Hardness HRC | 50HRC±2 | 44HRC±2 |
| Working Temperature | ≤400℃ | ≤400℃ |
| Thermal Conductivity | ≥25W/MK at 300℃ | ≥18W/MK at 300℃ |
- Premium Japanese NAS630 & NAS301 steel materials
- Advanced heat treatment and grinding manufacturing processes
- Minimal high-temperature warpage with extended service life
- Superior thermal conductivity and thermal expansion coefficient
- High corrosion resistance and exceptional hardness
- Compatible with various lamination steel plate washing machines
Japanese NAS630 and NAS301 precipitation hardening steel plates (NAS630 preferred for most applications)
1.6mm, 1.5mm, 1.8mm, 2.0mm
8-10 years (recommended minimum thickness: 1.3mm)
1500×1295mm, 1300×800mm, 1295×787mm, 1295×1613mm, 1295×1143mm, and other custom sizes
These high-precision lamination steel plates are essential components in PCB manufacturing, widely used with major laminator brands including BURKLE, LAUFFER, CEDAL, HELD, DATIAN, WEIDI, and DIPUER systems.
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