NAS301 Copper Clad Laminate Press Plate 1.0-1.8mm Thickness for PCB Manufacturing with 44HRC Hardness
High-precision lamination steel plate specifically designed for copper clad laminate (CCL) manufacturing processes in PCB production. This NAS301 Japan material pin-lam plate delivers exceptional thermal performance and mechanical strength for reliable circuit board fabrication.
| Property | NAS301 Pin-Lam Plate |
|---|---|
| Material | NAS301 Japan (Dura420 Steel) |
| Thickness | 1.0-1.8mm (±0.05mm tolerance) |
| Maximum Dimensions | 3150mm × 1060mm |
| Surface Roughness | Ra ≤ 0.15μm, Rz ≤ 1.5μm |
| Yield Strength | ≥1175 N/mm² |
| Tensile Strength | ≥520 N/mm² |
| Hardness | 44HRC ± 2 |
| Operating Temperature | ≤400°C |
| Thermal Conductivity | ≥18W/mK at 300°C |
| Thermal Expansion Coefficient | 15-17 × 10⁻⁶/°C |
| Warpage | ≤3mm/m |
- High-precision surface finish with Ra ≤ 0.15μm
- Exceptional thermal conductivity for uniform heat distribution
- Premium NAS301 Japan material with 44HRC hardness
- Optimized for CCL lamination processes up to 400°C
- Compatible with major CCL laminators including BURKLE, LAUFFER, CEDAL, HELD, DATIAN, WEIDI, and DIPUER
- Extended service life of 5-8 years with proper maintenance
Specifically designed for copper clad laminate (CCL) manufacturing in printed circuit board production. Essential for creating reliable, high-quality PCBs with consistent performance characteristics.
Available in standard dimensions including 1910×1270mm, 2210×1270mm, and 2220×1270mm. Custom sizes available upon request to meet specific production requirements.
Minimum order quantity: 100 pieces. Product is packaged in export-grade plywood cases with protective wrapping to ensure safe transportation and delivery.
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