Japanese NAS301 Copper Clad Laminate Plate 1.0-1.8mm Thickness, 44HRC Hardness for PCB & CCL Applications
Price:
Negotiable
MOQ:
100pcs
Delivery Time:
about 10-15days after getting advance payment
Brand:
EastStar
Product Description
Japanese Material Copper Clad Laminate Plate
Product Overview
High-performance copper clad laminate plate manufactured using premium NAS301 material from Japan, designed for demanding PCB and CCL lamination applications. Features exceptional thermal stability, precise dimensional control, and superior surface quality.
Key Specifications
Core Technical Parameters
Material: NAS301 Japan
Hardness: 44HRC ±2
Thermal Expansion: 10-12 (10⁻⁶/°C)
Operating Temperature: ≤400°C
Thermal Conductivity: ≥18W/mK at 300°C
Surface Roughness: Ra≤0.15, Rz≤1.5 μm
Dimensions & Tolerances
| Parameter | Value |
|---|---|
| Thickness | 1.0-1.8mm (±0.05mm) |
| Width | ≤1060mm |
| Length | ≤3150mm |
| Warpage | ≤3mm/M |
| Parallelism | ≤0.03 |
Performance Features
- Excellent thermal stability with controlled expansion coefficient
- High hardness for superior wear resistance and durability
- Precision surface finish for optimal lamination performance
- Superior dimensional accuracy and flatness
- High temperature resistance up to 400°C
Applications
Ideal for PCB fabrication and CCL lamination processes requiring precise dimensional control, thermal stability, and consistent surface quality. Suitable for both mass-lam and pin-lam plate configurations.
Ordering Information
Model: ESSP-CCL-400
Minimum Order: 100 pieces
Packaging: Export-grade plywood cases
Delivery: 10-15 days after advance payment
Payment: T/T transfer
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin