SUS301H Copper Clad Laminate Plate 450 HRC Hardness for PCB Manufacturing with ≤0.03 Parallelism
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
about 5-7days after getting advance payment
Brand:
EastStar
Product Description
Product Overview
The SUS301H Copper Clad Laminate Plate is a high-performance steel press plate designed for CCL lamination applications in PCB manufacturing. Manufactured from premium Japanese SUS301H material, this plate delivers exceptional durability and precision for demanding industrial processes.
Key Specifications
| Parameter | Value |
|---|---|
| Material | Steel SUS301H (Japanese) |
| Thickness Options | 0.5mm, 1.0mm, 1.2mm |
| Maximum Dimensions | ≤1300mm width × ≤2410mm length |
| Hardness | ≥450 HRC |
| Working Temperature | ≤280℃ |
| Parallelism | ≤0.03 |
| Warpage Degree | ≤3mm/M |
| Surface Roughness | Ra≤0.14μm / Rz≤1.50μm |
| Thermal Conductivity | 15W/MK at 300℃ |
Primary Applications
- CCL Press Plate for PCB manufacturing
- Copper foil lamination processes
- PCB/CCL partition steel plate applications
Technical Features
- High temperature resistance up to 280℃
- Exceptional hardness rating of 450 HRC
- Precision parallelism within 0.03 tolerance
- Minimal warpage for consistent lamination results
- Glossy surface finish for optimal performance
Product Images
Customization & Ordering
Minimum Order: 100 pieces | Delivery: 10-15 days | Payment: T/T
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin