NAS301 JAPAN Material CCL Lamination Steel Plate 1.0-1.8mm Thickness for PCB Manufacturing
The NAS301 JAPAN Material Pin-Lam Plate Copper Clad Laminate (CCL) Lamination Steel Plate ESSP-CCL-400 is a high-precision steel plate specifically designed for CCL copper clad laminate lamination processes in PCB manufacturing. This specialized component provides exceptional durability and thermal performance for high-quality circuit board production.
| Parameter | Value |
|---|---|
| Material | NAS301 JAPAN Steel |
| Thickness | 1.0-1.8mm (±0.05mm tolerance) |
| Working Temperature | ≤400°C |
| Tensile Strength | ≥520 N/mm² |
| Yield Strength | ≥1175 N/mm² |
| Hardness | 44HRC ±2 |
| Thermal Conductivity | ≥18W/MK at 300°C |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm |
- High-precision manufacturing for consistent performance
- Excellent thermal conductivity for efficient heat transfer
- Superior surface finish with Ra≤0.15μm roughness
- Exceptional mechanical strength with yield strength ≥1175 N/mm²
- Long service life of 5-8 years with proper maintenance
- Compatible with major CCL laminators including BURKLE, LAUFFER, CEDAL, and HELD
This CCL lamination steel plate is essential for PCB manufacturing processes, specifically designed for copper clad laminate production. It serves as a critical component in creating high-quality circuit boards with reliable interconnection, insulation, and support functions.
Comprehensive technical support is available for installation, troubleshooting, and maintenance. Customization services are offered to meet specific customer requirements and ensure optimal performance.
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