ESSP-S630T Copper Clad Laminate Press Plate 2220×1270mm SUS630T Steel 1.0-2.0mm Thickness
High-precision SUS630T steel plate designed for PCB and CCL lamination processes with competitive pricing and reliable performance.
The ESSP-S630T is a premium lamination steel plate manufactured using high-quality SUS630T material, specifically engineered for printed circuit board (PCB) and copper clad laminate (CCL) production. This plate offers exceptional thermal performance and dimensional stability for industrial lamination applications.
| Parameter | Mass-Lam Plate | Pin-Lam Plate |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Maximum Width | ≤1300mm | ≤1300mm |
| Maximum Length | ≤2410mm | ≤2410mm |
| Thickness Tolerance | ±0.10mm | ±0.10mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Hardness | 50HRC±2 | 50HRC±2 |
| Thermal Conductivity | ≥18W/MK at 300℃ | ≥18W/MK at 300℃ |
- Competitive pricing with reliable lamination performance
- Superior thermal conductivity and thermal expansion coefficient for energy efficiency
- High corrosion resistance and hardness for extended service life
- Compatible with various types of lamination steel plate washing machines
- Excellent dimensional stability with minimal warpage
1500×1295mm, 1300×800mm, 1295×787mm, 1295×1613mm, 1295×1143mm, 1285×750mm, 1280×1120mm, 1280×1070mm, 1280×970mm, 1270×1118mm, 1270×1070mm, 1143×660mm, 673×571mm, 660×508mm, 24"×28"
1910×1270mm, 2210×1270mm, 2220×1270mm
Manufactured from premium SUS630T steel with standard thickness options of 1.0mm, 1.2mm, 1.5mm, 1.6mm, 1.8mm, and 2.0mm. Custom sizes available upon request to meet specific production requirements.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.