Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance
The Hot Press Cushion Pad is an essential accessory designed specifically for the PCB laminating process, providing excellent performance and durability for professionals involved in printed circuit board manufacturing. This high-quality printed circuit board press pad serves as a reliable buffering pad during the lamination process, ensuring even pressure distribution and protection of delicate components.
- Exceptional service life of 300-500 uses for long-lasting performance
- Available in white, black, or yellow to suit operational preferences
- High tensile strength of ≥ 25 MPa for reliable performance under pressure
- Variable weight based on size and thickness for customizable applications
- Square shape for uniform pressure distribution and easy handling
| Parameter | Specification |
|---|---|
| Standard Sizes | 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm |
| Thickness | 4mm - 6.5mm (Top/Bottom) / 1.5mm - 2.0mm (Middle Layer) |
| Usage | Rigid Printed Circuit Board Lamination |
| Color Options | White, Black, Yellow |
| Tensile Strength | ≥ 25 MPa |
| Material | High-Quality Rubber |
| High Temperature Resistance | ≤ 280℃ |
| Water Absorption | < 8% (3-8%) |
| Buffer Standard | ≥ 12% |
| Shape | Square |
The EastStar Hot Press Cushion Pad (Model: ESCP-PCB-G2) is specifically designed for rigid printed circuit board lamination processes. Its precise thickness options and square shape make it highly versatile for different lamination press requirements in PCB fabrication plants and electronics assembly lines.
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