10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board
Two-Component 10:1 Potting Compound For Sealing Circuit Board Led Module Power Potting Protecting Non-Corrosive Low Viscosity Potting Compound
PRODUCT DESCRIPTION of 10:1 Potting Compound
HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.
Product features of 10:1 Potting Compound:
1. This potting silicone rubber has high moisture resistance and a wide temperature range of - 57°C to 250°C.
2. Condensed liquid silicone rubber does not use polar compounds as raw materials, and does not release by-products during cross-linking, and can maintain better electrical properties under harsh conditions.
3. Non-toxic, odorless, non-corrosive, non-swelling.
4. It has adhesive force, has adhesion to metal aluminum, iron, acrylic, and PC plastic, and can improve waterproof sealing performance.
Main Application of 10:1 Potting Compound
It is mainly used in circuit boards, LED power supplies, waterproof power supplies, automotive electronic modules, electrical appliances, light sources, lamps, and their accessories for potting protection. Especially for potting with adhesive requirements on aluminum substrates.
Main Feature of 10:1 Potting Compound
1. This potting silicone rubber has high moisture resistance and a wide temperature range of - 57°C to 250°C.
2. Condensed liquid silicone rubber does not use polar compounds as raw materials, and does not release by-products during cross-linking, and can maintain better electrical properties under harsh conditions.
3. Non-toxic, odorless, non-corrosive, non-swelling.
4. It has adhesive force, has adhesion to metal aluminum, iron, acrylic, and PC plastic, and can improve waterproof sealing performance.
| Before Mixing | ||
| A | B | |
| Exterior | black liquid | Transparent liquid |
| Base chemical composition | Polysiloxane | Polysiloxane |
| Viscosity (cP) (GB/2794-1995) | 2000-2800 | 20-30 |
| Density (g/cm³) (GB/2794-1995) | 1.42±0.02 | - |
| A+B after mixing | ||
| Exterior | black liquid | |
| Base chemical composition | Polysiloxane (Silicone) | |
| Viscosity (cP) (GB/2794-1995) | 2000-2600mpa's | |
| Density (g/cm³) (GB/2794-1995) | 1.40±0.02 | |
| Operating time (25℃, min) | 40-60 | |
| Curing time (25℃, h) | 4-6 | |
| Hardness (shore A) (GB/T531-1999) | 30-40 | |
| Volume resistivity Ω·cm (GB/T 31838.2-2019) | ≥5.0×10 14 |
| Thermal conductivity (W/M▪K) (GB/T 38712-2020) | 0.5±0.1 |
| Dielectric strength (kv/mm) | ≥14 |
| Dielectric constant | ≤3.5 |
| Elongation at break (%) | ≤100% |
HOW TO USE 10:1 Potting Compound
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
About us
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.