Thermally Conductive Liquid Clear Silicone Gel Bulk RTV Potting Compound For Electronics PCB
Thermally Conductive RTV Potting Compound For Electronics PCB High -Temp Potting Glue Low -Viscosity Flexible Waterproof Adhesive Potting
Product Description:
Two-component addition type silicone potting rubber for electronic components, which can be cured into high-performance elastomer by room temperature or heating.
Technical Parameters
| Test Items | Test Standard | Units | Product test results | |||
| Part A | Part B | |||||
| Before curing | 1 | Appearance | --- | --- | Grey, fluid | White, fluid |
| 2 | Viscosity | GB/T10247-2008 | 25ºC, mPa·S | 4500~5000 | 4500~5000 | |
| 3 | Density | GB/T 13354-92 | 25ºC, g/cm³ | 1.50±0.05 | 1.50±0.05 | |
| 4 | Mixing Ratio (A : B) | 1:1 | Weight ratio | 100 | 100 | |
| Volume ratio | 100 | 100 | ||||
| 5 | Operating time | Measured | hr | 0.3-0.4 | ||
| 6 | Curing condition | Measured | hr | 4^12 (25ºC,initial cure) | ||
| 0.20 (80ºC) | ||||||
| After Curing |
7 | Appearance | --- | --- | Grey elastomer | |
| 8 | Hardness | GB/T 531.1-2008 | Shore A | 50±5 | ||
| 9 | Thermal conductivity | GB/T10297-1998 | w/m·k | ≥0.76 | ||
| 10 | Expansivity | GB/T20673-2006 | μm/(m,ºC) | 210 | ||
| 11 | Moisture Absorption | GB/T 8810-2005 | 24h,25ºC, % | 0.01~0.02 | ||
| 12 | Volume resistivity | GB/T 1692-92 | (DC500V),Ω · cm | 1.0×10¹⁵ | ||
| 13 | Dielectric intensity | GB/T 1693-2007 | Kv/mm(25ºC) | 18^25 | ||
| 14 | Temperature Resistance | Measured | ºC | -50~+250°c | ||
Product Feature:
1.1. At room temperature, the A/B glue can be operated for a long time after mixing (operable time: the period before the glue gels and thickens); under heating conditions, it can be quickly cured, which is conducive to use on automatic production lines. 1.2. It has high temperature resistance: after the glue is completely cured, it can maintain the elasticity and insulation properties of silicone rubber in the temperature range of (-60 ~ 250) ℃
Product Application:
Used for potting and thermal insulation of battery packs, potting and protection of high-power electronic components in module power supplies and circuit boards. Such as automotive HID lamp module power supplies, automotive ignition system module power supplies, solar panels, transformers, sensors, etc.
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