Low Viscosity Potting Silicone HN-8806A/B | Easy Pouring & Excellent Penetration for PCBA

Product Overview for silicone potting compound:

Ensures protection everywhere. The low viscosity of HN-8806 (2000-3000 mPa·S) allows it to easily penetrate every corner of high-density PCBAs, encapsulating fine-pitch components and micro parts, achieving complete, gap-free protection.

Key Features:Low Viscosity & Easy Flow | Excellent Penetration | Easy Vacuum Deaeration | Repairable Elastic Cure | Good Adhesion to Various Materials.

Technical Parameters for silicone potting compound:

Viscosity (A&B, @25°C): 2000-3000 mPa·S

Hardness (Shore A): 45±5

Pot Life (@25°C): 0.3-0.4 hours

Dielectric Strength: 18-25 kV/mm

Volume Resistivity: 1.0×10¹⁶ Ω·cm

Product Applications for silicone potting compound:

High-Density PCBAs:Communication motherboards, server boards, high-pin-count control boards.

Miniaturized Electronics:Wearable devices, sensor modules, boards with 01005/0201 components or BGAs.

Automotive ECUs:Circuit protection for Automotive Electronic Control Units.

Precision Circuits:Instrumentation, internal boards of data acquisition cards.

Usage Instructions for silicone potting compound:

1. StandardPreparationandMixing.

2. Potting:Use pouring, potting, or injection methods, allowing it to flow and spread naturally.

3. Deaeration:Vacuum deaeration is highly recommended to remove trapped air in tight spaces.

4. Curing:Cure at room temperature or with heat.

Important Notes for silicone potting compound:

For PCBAs with bottom-side components, tilting the board or gentle vibration aids underfill.

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

FAQ for silicone potting compound:

Q: Does low viscosity mean it's prone to leaking?

A: No, if the housing is properly sealed, the compound itself will not leak. Low viscosity primarily aids filling.

Q: Can it penetrate under tiny components?

A: Yes, its excellent flow allows it to encapsulate fine-pitch leads, under BGAs, and other hard-to-reach areas.

Q: How to minimize bubbles?

A: Stir in one direction, gently vibrate the assembly after potting, or use the most effective method – vacuum deaeration.

Q: Is it repairable after curing?

A: Yes, as an elastomer, it can be locally cut and peeled using specialized tools and solvents, though skill is required.

Q: Does it adhere well to different PCB materials?

A: It adheres well to most common materials. For specific low-surface-energy plastics, please consult us.