2.0 W/m·K Silicone Potting Compound | HN-8820 A/B | RTV Addition Cure

Product Overview for Thermally Conductive Potting Compound:

HN-8820 A/B is a low-viscosity, RTV addition-type silicone potting material with 2.0 W/m·K thermal conductivity. It ensures effective heat management and electrical safety for modern electronic devices.

Key Benefits for Thermally Conductive Potting Compound:

Efficient thermal management

1:1 mix for easy handling

Long pot life for production flexibility

Stable performance across temperatures

Technical Parameters for Thermally Conductive Potting Compound:

Density: 2.36 g/cm³

Cure @ 80°C: 10–20 min

Volume Resistivity: ≥5.0×10¹⁴ Ω·cm

Flame Retardancy: V-0

Applications for Thermally Conductive Potting Compound:

PCB potting

Ignition coils

Power converters

Industrial controls

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.

Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.

Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

FAQ for Thermally Conductive Potting Compound:
•Q: How long does it take to cure at 80°C?
A: 10–20 minutes.
• Q: Is it suitable for automotive use?
A: Absolutely.
• Q: Can it be used on flexible circuits?
A: Yes, it remains elastic.
• Q: What is the pot life?
A: 1–2 hours at 25°C.
• Q: Is it RoHS compliant?
A: Yes, it is.