HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0
HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0
Product Overview for Thermally Conductive Potting Compound:
HN-8820 is a user-friendly, two-part silicone gel with 2.0 W/m·K thermal conductivity and V-0 flame resistance. Ideal for protecting electronics from heat, moisture, and mechanical stress.
Why Choose HN-8820 for Thermally Conductive Potting Compound?
Fast curing options available
Excellent fluidity for complex shapes
High insulation and thermal performance
Resists yellowing and degradation
Technical Parameters for Thermally Conductive Potting Compound:
Viscosity: 5000–8000 cP
Operating Temp: -40°C to 150°C
Hardness: 45–50 Shore A
Thermal Conductivity: 2.0 W/m·K
Applications for Thermally Conductive Potting Compound:
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HID lighting modules
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Automotive ECUs
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Telecom hardware
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Power supplies
Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.
Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.
Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.
FAQ for Thermally Conductive Potting Compound:
Q: Can I use it for outdoor electronics?
A: Yes, it resists moisture and UV aging.
Q: What’s the hardness after curing?
A: 45–50 Shore A.
Q: Is it paintable?
A: Not recommended.
Q: How should I mix it?
A: Use 1:1 ratio by weight.
Q: Does it shrink after curing?
A: Minimal shrinkage.
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