Thermal Potting Compound 2.0 W/m·K | HN-8820 | For Power Modules & Transformers

Product Overview for Thermally Conductive Potting Compound:

This thermally conductive potting compound (2.0 W/m·K) is designed for high-power modules and transformers, providing electrical isolation and heat dissipation in one material.

Performance Highlights for Thermally Conductive Potting Compound

•Effective heat transfer

•Electrical insulation

•Easy 1:1 mixing

•Long-term stability

Technical Parameters for Thermally Conductive Potting Compound:

• Viscosity: 5000–8000 cP

•Density: 2.36 g/cm³

•Pot Life: 1–2 hrs

•Cure: 2–4 hrs @ 25°C

Applications for Thermally Conductive Potting Compound:

• High-power LED modules

• Transformer potting

• Inverter systems

• Charging stations

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.

Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.

Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

FAQ for Thermally Conductive Potting Compound:

Q: Can I use it for high-voltage transformers?
A: Yes, it has high dielectric strength.

Q: Does it require special equipment?
A: Only mixing and degassing tools.

Q: Is it suitable for potting large components?
A: Yes, due to good flow.

Q: What is the service temperature?
A: -40°C to 150°C.

Q: Is it certified?
A: UL94 V-0 recognized.