Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/M·K | Moisture Resistant

Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/m·K | Moisture Resistant

Product Overview for Thermally Conductive Potting Compound:

HN-8820 low-viscosity potting gel ensures deep penetration and complete encapsulation. With 2.0 W/m·K thermal conductivity, it protects components from heat and humidity.

Performance Highlights for Thermally Conductive Potting Compound

•Low viscosity for intricate geometries

•1:1 mix ratio

•Moisture and humidity resistance

•Fast heat-assisted curing

Technical Parameters for Thermally Conductive Potting Compound:

• Viscosity: 5000–8000 cP

•Density: 2.36 g/cm³

•Pot Life: 1–2 hrs

•Cure: 2–4 hrs @ 25°C

Applications for Thermally Conductive Potting Compound:

• Dense circuit boards

• Miniaturized electronics

• Underwater sensor housings

• Communication devices

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.

Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.

Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

FAQ for Thermally Conductive Potting Compound:

Q: How low is the viscosity?
A: 5000–8000 cP – easy flow.

Q: Can it be used in humid environments?
A: Yes, it resists moisture.

Q: Is it suitable for fine-pitch components?
A: Yes, it flows into small gaps.

Q: Does it adhere to metals?
A: Yes, with proper surface prep.

Q: Can I get a sample?
A: Contact us for sample requests.