Electrical Epoxy Potting Material Black Clear High-Temperature Epoxy Potting Adhesive Potting Compound For Led Driver Power Module
Electrical Epoxy Potting Material Black Clear High-Temperature Epoxy Potting Adhesive Potting Compound For Led Driver Power Module
Product description of Epoxy Potting Adhesive
Epoxy potting compound is a liquid polymer material primarily composed of epoxy resin, along with curing agents, fillers, and functional additives. It is used in fields such as electronic components and precision instruments to provide insulation, sealing, moisture resistance, dust protection, and shock resistance. After curing, it forms a hard, high-performance insulator and is widely used in the electronics, automotive, and new energy industries.
Product features of Epoxy Potting Adhesive
Electrical insulation, waterproofing and moisture resistance, dustproof, corrosion resistance, high and low temperature resistance, vibration resistance, improved mechanical strength, and confidentiality.
Physical Properties of epoxy potting adhesive
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Application Scenarios of epoxy potting adhesive
Electronics and Electrical Appliances: Circuit boards, LED power supplies, sensors, capacitors, etc.
Automotive/New Energy: Electronic control units, igniters, motors.
Other: Aerospace, instrumentation, etc.
Package:
This product is 40KG per group;
Component A is 20KG (in barrels), and Component B is 20KG (in barrels)
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