Electronic Grade KL-201 Liquid Hot Melt - High Peel Strength for FPC & Shielding Materials

Description:

A high-quality liquid hot melt supplier solution for the electronics industry. KL-201 provides the extreme bonding force needed for delicate electronic laminations.

Application:

Flexible Printed Circuits (FPC), EMI shielding, and copper foil lamination.

Parameters:

Viscosity 5000-10000cps; Solid Content 45±5%; Color: Yellowish

Features:
• High peeling force (4-5kg/25mm);

•Heat stable;

•Chemical resistant.

Packaging:

20kg/drum or 180kg/drum; Custom OEM packaging available.

Notes:

Protect from freezing during transport; clean equipment with water before the glue dries.

QA:

1. Q: Is it suitable for FPC?

A: Yes, it is a premier FPC lamination liquid adhesive.
2. Q: Can it handle the heat of soldering?

A: It is designed for high-temperature stability in electronic assembly.
3. Q: Is it bulk available?

A: Yes, we provide bulk liquid hot melt adhesive in 180KG drums.
4. Q: What is the solid content?

A: High solid content of 40-50% for efficient coating.
5. Q: Does it bond to PEI?

A: Yes, it is an excellent adhesive for PEI and other high-performance plastics.