Shockproof Silicone Potting Compound For Industrial Sensor And Transducer Protection

Product Overview for silicone potting compound:

Boost your production efficiency. HN-8806 A/B reaches initial cure within 2 to 3 hours at 25°C, enabling fast turnaround for subsequent processes. Curing can be further sped up with heating — just 0.2 hours at 80°C. It is an ideal choice to streamline your production.

Technical Parameters for silicone potting compound:

Product Applications for silicone potting compound:

1. Power Supplies, Drivers, PCBs
2. LEDs, EV Charging Stations, PV Inverters
3. New Energy Batteries, Sensors, Automotive Electronics

Usage Instructions for silicone potting compound:

1. Preparation: Get all parts ready before potting.

2. Mixing: Weigh and blend the two components at 1:1 ratio swiftly, and finish mixing within pot life.

3. Potting: Start encapsulation immediately.

4. Curing: At 25°C, the material is ready for handling in 2–3 hours. For full cure, bake at 80°C for 12 minutes.

FAQ for silicone potting compound:

Q: Can the part be moved after initial cure?

A: Yes, after initial cure, the part has sufficient strength for careful handling and light subsequent operations.

Q: How can I cure it faster?

A: Heating at 80°C for 0.2 hours (approx. 12 mins) achieves full cure.

Q: Does the compound harden immediately after the pot life?

A: No, it begins to thicken and enter the curing stage gradually, but completion within the pot life is recommended.

Q: Does fast curing mean a shorter shelf life?

A: No, cure speed and shelf life are separate. The unmixed components have a 6-month shelf life.

Q: Can heat curing damage my components?

A: 80°C is safe for most components. Evaluate or choose room temperature cure if extremely heat-sensitive parts are present.