10:1 Two-Component Silicone Potting Compound For For EV Battery Packs ECU Modules High-Performance Electrical Insulation And Protection
10:1 Two-Component Silicone Potting Compound For For EV Battery Packs ECU Modules High-Performance Electrical Insulation And Protection
Product description of silicone potting compound:
In the electronics industry, 10:1 silicone potting compounds are defined as the ultimate barrier for "three-proofing" (protection against moisture, salt spray, and mold) and thermal management. They possess three core functions: Electrical Insulation and Dielectric Protection—featuring exceptionally high dielectric strength, they completely isolate circuits from external moisture and conductive dust, thereby preventing high-voltage breakdown and short circuits. Thermal Stress Relief—as automotive and consumer electronics generate significant heat during operation, alternating cycles of heating and cooling cause components to undergo thermal expansion and contraction; the superior flexibility of the 10:1 compound absorbs this deformation, preventing solder joints from being fractured. Extreme Environment Resistance (Ultra-Wide Temperature Range)—capable of maintaining their physical elasticity and electrical performance over the long term—without degradation—across an extreme temperature range of -50°C to 200°C (or even higher).
Technical Parameters of 10:1 Silicone Encapsulant
| № | Itrems | Technique Request |
| 1 | Appearance |
Transparent, White, Black Flowing Liquid |
| 2 | Viscosity (before curing) (mPa.S) | A:2000 B:50 |
| 3 | Specific Gravity (23℃) | 0.98 |
| 4 | Available Time (h, 25℃) | 1-2h |
| 5 | Entirely Cure Time (h, 25℃) | 8-12h |
| 6 | Shaw Hardness (JIS A) | 25A |
| 7 | Volume Resistivity (Ω cm) | ≥1×1014 |
| 8 | Strength of Breakdown Voltage (kv / mm) | 18-25 |
| 9 | Dielectric Constant (1MHZ) | 2.5 - 3.0 |
| 10 | Dielectric Loss Angle Tangent (1MHZ) | ≤4×10-3 |
| 11 | Thermal Conductivity (w / m.k) | 0.1 - 0.20 |
Main features of Silicone Potting Compound:
Hardness:25 shore A
Mix raio:10:1
Color:transparent
Viscosity (before curing) (mPa.S):A:2000 B:50
wide temperature range:- 57°C to 250°C
Application Areas for Silicone Potting Compound:
Consumer Electronics;LED Lighting & Power Supplies;Automotive Electronics etc
How to use 10:1silicone potting compound?
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
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