High Thermal Conductivity Silicone Potting Compound One To One Ratio For New Energy Battery Module Encapsulation

Your trusted thermal management solution. Custom-developed for heat dissipation, HN-8806 delivers thermal conductivity ≥0.76 W/m*K. It efficiently lowers operating temperatures of power components to boost equipment reliability and extend service life. Retaining outstanding electrical insulation performance, it serves as an optimal thermal interface material for power electronic encapsulation.

• Power Modules: Direct encapsulation for IGBT, MOSFET, diodes and other power semiconductor components
• LED Drivers: Thermal conduction and all-round protection for high-power outdoor LED driver power supplies
• New Energy Equipment: Power units of photovoltaic inverters and PCS modules for energy storage systems
• Industrial Drives: Heat dissipation & electrical insulation for power parts of inverters and servo drivers

1. Surface Preparation: Clean all heat-generating components and heat sink surfaces completely to maximize thermal conduction efficiency.
2. Mixing & Vacuum Degassing: Stir the two components evenly, then perform vacuum deaeration; trapped air bubbles severely weaken thermal conductivity.
3. Potting Operation: Pour the compound to fully cover heat-generating parts and achieve full contact with cooling substrates.
4. Curing Process: Cure the assembly under ambient temperature or elevated temperature per process requirements.