High Insulation Silicone Potting Compound Low Shrinkage Low Stress For Charging Pile Module Potting
High Insulation Silicone Potting Compound Low Shrinkage Low Stress For Charging Pile Module Potting
Product Overview for silicone potting compound:
Professional solution for thermal management
HN-8806 is engineered for efficient heat dissipation with thermal conductivity ≥0.76 W/m·K.
It effectively cut down working temperature of power components, improving reliability and service life.
With outstanding electrical insulation, it becomes the perfect option for power electronics cooling.
Key Features for silicone potting compound:
| Thermal Conductivity | ≥0.76 W/m·K |
| Coefficient of Thermal Expansion (CTE) | 210 μm/(m·°C) |
| Operating Temperature Range | -50°C ~ +250°C |
| Hardness (Shore A) | 45±5 |
Product Applications for silicone potting compound:
1. Power Modules: Direct potting for IGBT, MOSFET, diode and other power devices
2. LED Drivers: Thermal management & protection for high-power outdoor LED drivers
3. New Energy: Power parts of PV inverters, energy storage PCS units
4. Industrial Drives: Thermal dissipation and insulation for inverter & servo drive power assemblies
Usage Instructions for silicone potting compound:
Keep heat-generating components and heat sink surfaces clean to maximize thermal transfer efficiency.
Achieve full homogeneous mixing followed by vacuum degassing. Air voids severely impair thermal conductivity.
Make certain the potting compound completely surrounds heat sources and maintains full contact with cooling surfaces.
Carry out curing at ambient temperature or elevated temperature according to process requirements.
Packaging & Storage for silicone potting compound:
Standard Packaging: 25kg per drum for both Part A and Part B.
Storage: Keep in cool and dry conditions.
Shelf Life: 6 months for unopened original packaging.
FAQ for silicone potting compound:
Q: What level is 0.76 W/m·K?
A: It is a medium-high level for potting compounds, suitable for most power electronics, effectively reducing hot-spot temperatures.
Q: Are thermal conductivity and electrical insulation contradictory?
A: No, this product is designed for electronics, balancing both thermal and electrical performance.
Q: How to achieve the best cooling effect?
A: Ensure full contact between the compound, heat source, and housing, with no air bubbles.
Q: Does it bleed silicone oil?
A: No, it cures into a stable elastomer with no risk of silicone oil separation.
Q: Do you have higher conductivity grades?
A: Yes, for requirements >1.5 W/m·K, please contact us for advanced grades.
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