Thermal Conductive Potting Compound 2.0W/M・K For New Energy Module Heat Dissipation

Thermal Conductive Potting Compound 2.0W/M・K For New Energy Module Heat Dissipation

Product Overview for Thermally Conductive Potting Compound:
HN-8820 is a two-part addition-cure silicone potting gel featuring high thermal conductivity of 2.0 W/m·K and excellent electrical insulation. Supplied with a convenient 1:1 mixing ratio for simple processing, it delivers dependable protection for electronic equipment working under harsh conditions within the temperature range of -40°C ~ 150°C.

Product Features for Thermally Conductive Potting Compound:

Outstanding thermal conductivity: 2.0 W/m·K

UL 94 V-0 flame retardant grade

High volume resistivity (>5.0×10¹⁴ Ω·cm)

Waterproof, moisture-resistant and anti-aging

Broad operating temperature range

Technical Parameters for Thermally Conductive Potting Compound:

Mix Ratio: 1:1 (A:B)

Viscosity: 5000–8000 cP

Pot Life (25°C): 1–2 hours

Cure Time (25°C): 2–4 hours

Hardness: 45–50 Shore A

Applications for Thermally Conductive Potting Compound:

Power modules

Automotive electronics

Network transformers

LED drivers

Sensor modules

Packaging & Storage for Thermally Conductive Potting Compound:
Package specification: 50 kg/set (Part A: 25 kg + Part B: 25 kg)

Storage: Keep in cool and dry conditions

Shelf Life: 6 months

FAQ for Thermally Conductive Potting Compound:

Q: Is it suitable for high-voltage applications?
A: Yes, it offers high insulation resistance.

Q: Can I use it for potting transformers?
A: Yes, it’s widely used in network transformers.

Q: Does it resist yellowing?
A: Yes, it offers excellent anti-aging performance.

Q: What is the thermal conductivity?
A: 2.0 W/m·K.

Q: Is it flame retardant?
A: Yes, rated V-0.