Thermally Conductive Potting Compound HN-8820 2.0W/mK Silicone Encapsulant For EV Battery Module Heat Dissipation
Price:
Negotiable
MOQ:
1 KG
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Brand:
Hanast
Product Description
Thermally Conductive Potting Compound HN-8820 2.0W/mK Silicone Encapsulant For EV Battery Module Heat Dissipation
Product Overview
HN-8820 is a high-performance two-part addition-cure silicone potting compound manufactured by Shenzhen Hanast New Material Co., Ltd. Engineered specifically for EV battery module heat dissipation, energy storage systems, and power electronics, this RTV-2 silicone encapsulant delivers 2.0W/mK thermal conductivity with UL 94 V-0 flame retardant certification.
Key Features
- Superior Thermal Management: 2.0W/mK thermal conductivity effectively prevents thermal runaway in high-power density modules
- UL 94 V-0 Flame Retardant: Certified for maximum fire safety in high-voltage electronics
- 1:1 Mix Ratio: Convenient processing with simple dispensing systems
- High Electrical Insulation: Volume resistivity >5.0E14 Ohm.cm, dielectric strength >25 kV/mm
- Broad Operating Range: Reliable protection from -40°C to 150°C
- Deep Section Cure: Addition-cure system cures uniformly at any depth without releasing heat
- Waterproof & Anti-aging: Excellent moisture resistance and long-term durability
B2B Applications
| Application | Description |
|---|---|
| EV Battery Modules | Thermal management encapsulation for liquid/air-cooled battery packs and BMS |
| Energy Storage Systems (ESS) | Potting compound for PCS and battery management systems |
| Charging Pile & EV Charger | DC fast charging station power module encapsulation |
| Solar Inverters | Photovoltaic inverter power unit protection |
| IGBT & MOSFET Modules | Power semiconductor encapsulation for industrial drives |
| Automotive Electronics | DC-DC converters, ECU, and HID lighting power supplies |
| LED Drivers | High-power outdoor LED driver thermal conduction and sealing |
| Network Transformers | Telecom equipment and 5G base station component potting |
OEM & Custom Formulation Services
As a direct silicone encapsulant manufacturer with a 40,000 sqm production base in Shenzhen, we offer:
- Custom formulation: Adjust viscosity, thermal conductivity, curing speed, and hardness to your specifications
- Bulk OEM supply: 500 KG/month production capacity with consistent batch quality
- Free sample testing: 1KG free sample for application verification before bulk order
- Technical support: MSDS, TDS, and application engineering guidance provided
- Competitive factory pricing: Direct from our Shenzhen/Guangdong facility to your production line
Technical Specifications
| Mix Ratio | 1:1 (A:B) by weight |
| Viscosity (Mixed) | 5000-8000 cPs |
| Pot Life (25°C) | 6-12 Month |
| Cure Time (25°C) | 4-6 hours |
| Hardness | 45-50 Shore A |
| Thermal Conductivity | 2.0 W/mK |
| Dielectric Strength | >25 kV/mm |
| Flame Retardant Rating | UL 94 V-0 |
Packaging & Logistics
- Standard packaging: 50 kg/set (Part A: 25 kg drum + Part B: 25 kg drum)
- MOQ: 1 KG for sample orders, bulk MOQ negotiable
- Shelf life: 6 months in cool, dry storage
- Worldwide shipping with full export documentation (MSDS, TDS, transport certificates)
Contact our factory today for thermal conductive potting compound pricing, samples, or custom formulation consultation. ISO 9001 certified, RoHS and REACH compliant.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hanast New Material co.,LTD
Location
Units 1210-1211, Block B, Building 6, Hengda Fashion Valley, Dalang Street, Longhua District, Shenzhen, Guangdong Province, China
Contact Person
Candy