Silicone Encapsulant HN-8820 2.0W/mK Thermal Potting Compound for Automotive Electronics Motor Drive RF Module
Price:
Negotiable
MOQ:
1 KG
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Brand:
Hanast
Product Description
Silicone Encapsulant HN-8820 2.0W/mK Thermal Potting Compound for Automotive Electronics Motor Drive RF Module
Product Overview
HN-8820 is a solvent-free two-part addition-cure silicone encapsulant manufactured by Shenzhen Hanast New Material Co., Ltd. Engineered for automotive electronics encapsulation, motor drive controller potting, RF communication module protection, and consumer electronics, this flexible thermal potting gel delivers 2.0W/mK thermal conductivity with excellent substrate adhesion and thermal cycling resistance. UL 94 V-0 certified with simple 1:1 processing and optional 80°C heat cure acceleration.
Key Performance Features
- Solvent-Free Formula: Zero VOC emissions, safe for enclosed electronic assemblies and clean room environments
- Excellent Substrate Adhesion: Bonds reliably to PCB, aluminum, copper, and most engineering plastics without primer
- Flexible & Elastic: Permanent rubber-like flexibility absorbs thermal expansion mismatches and mechanical stress
- Thermal Cycling Resistance: Maintains integrity through repeated -60°C to 200°C temperature cycles without cracking
- Overheating Protection: 2.0W/mK conductivity prevents hot-spot formation in high-power density electronics
- Fast Heat Cure Option: 10-20 minutes at 80°C for high-throughput automated production lines
- Self-Extinguishing: UL 94 V-0 rated, stops burning immediately after flame removal
- High Density Fill: 2.36 g/cm³ ensures complete void-free encapsulation for maximum thermal transfer
Application Scenarios
| Application | Protection Benefit |
|---|---|
| Automotive ECU Modules | Engine bay thermal cycling and vibration resistant encapsulation |
| Motor Drive Controllers | IGBT/MOSFET thermal management and electrical insulation for VFD and servo drives |
| Battery Management Systems | BMS circuit board moisture-proof and overheating protection |
| RF Communication Modules | Low-loss dielectric encapsulation for 5G and telecom RF power amplifiers |
| Consumer Electronics | Power adapter, charger, and smart home device potting with safety compliance |
| Automotive Sensors | Under-hood sensor module environmental sealing and heat dissipation |
| Industrial Automation | PLC, HMI, and factory control electronics long-term protection |
Thermal Management Solution Comparison
| Solution | Thermal Conductivity | Electrical Insulation | Environmental Seal | Reworkable |
|---|---|---|---|---|
| HN-8820 Silicone Encapsulant | 2.0 W/mK | Excellent | Complete | Yes |
| Thermal Gap Filler Pad | 1.0-5.0 W/mK | Limited | None | Yes |
| Thermal Grease/Paste | 1.0-8.0 W/mK | None | None | Yes |
| Epoxy Encapsulant | 0.5-1.5 W/mK | Good | Complete | No |
Custom Formulation & OEM Supply
As a direct silicone encapsulant manufacturer in Shenzhen, Guangdong, we provide:
- Adjustable viscosity: Custom formulated for specific dispensing and flow requirements
- Cure speed customization: Optimized pot life and cure profiles for automated production
- Hardness tuning: 35-55 Shore A range available for different flexibility needs
- Bulk supply: 500 KG/month with batch-to-batch consistency guarantee
- Free 1KG sample: Application testing with complete TDS and MSDS documentation
- MOQ from 1KG: Low minimum order for prototyping before scaling to volume production
- Private label OEM: Custom packaging and branding for your product line
Technical Specifications
| Parameter | Specification |
|---|---|
| Mix Ratio | 1:1 (A:B) by weight |
| Viscosity (Mixed) |
5000-8000 cPs |
| Pot Life (25°C) | 6-12Month |
| Cure Time (25°C) | 4-6 hours |
| Heat Cure (80°C) | 10-20 minutes |
| Hardness | 45-50 Shore A |
| Thermal Conductivity | 2.0 W/mK |
| Flame Retardant Rating | UL 94 V-0 (self-extinguishing) |
| Solvent Content | 0% (solvent-free formulation) |
Packaging & Storage
- Standard: 50 kg/set (25 kg Part A + 25 kg Part B drums)
- Resealable packaging: Tightly reseal after use; use within 6-month shelf life
- MOQ: 1 KG for sample orders, volume pricing available
- Storage: Cool, dry environment away from sulfur, tin, amines, and acidic substances
- Global export: Complete shipping documentation with MSDS and transport certificates
Contact our Shenzhen factory today for silicone encapsulant pricing per kg, free 1KG samples, or custom formulation consultation. ISO 9001 certified, RoHS and REACH compliant, solvent-free manufacturer.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hanast New Material co.,LTD
Location
Units 1210-1211, Block B, Building 6, Hengda Fashion Valley, Dalang Street, Longhua District, Shenzhen, Guangdong Province, China
Contact Person
Candy