Low Viscosity RTV Silicone Potting Compound Two Component 1:1 for IGBT Power Module Charging Pile Encapsulation
Product Overview
HN-8806 is a low-viscosity RTV two-component 1:1 addition cure silicone potting compound specifically developed for IGBT power module encapsulation and EV charging pile electronics protection. With its 4500-5000 mPa·s flowability, it penetrates densely packed PCB assemblies and under-fills tall components with ease — ideal for high-voltage power modules, fast-charging adapters, and battery pack sealing. Delivers 0.76 W/m·K thermal conductivity, UL 94 V-0 flame retardancy, and 18-25 kV/mm dielectric strength for demanding power electronics applications. RoHS and REACH compliant with factory-direct bulk supply available.
Key Features for IGBT & Charging Pile Applications
- ✅ 4500-5000 mPa·s Low Viscosity — Superior flowability for complete PCB penetration around IGBT modules, transformers, and dense SMD assemblies without trapped air pockets
- ✅ 0.76 W/m·K Thermal Conductivity — Reliable heat dissipation from IGBT power semiconductors and high-frequency transformers in fast-charging stations
- ✅ 18-25 kV/mm Dielectric Strength — Critical high-voltage insulation for 800V EV charging architectures and high-voltage power modules
- ✅ UL 94 V-0 Flame Retardant — Mandatory safety compliance for public EV charging infrastructure installed in parking structures and commercial buildings
- ✅ 1:1 Mix Ratio with 0.3-0.4 hr Pot Life — Optimized working time for manual and automated potting of large charging pile power modules
- ✅ -50°C to 250°C Temperature Range — Stable performance from arctic winter charging stations to desert solar-powered charging hubs
- ✅ Low Shrinkage & Non-Corrosive — Zero stress on IGBT wire bonds and sensitive power semiconductor junctions during cure
- ✅ Deep Section Curing — Uniform cure through thick potting sections in high-voltage transformer and inductor assemblies
Technical Specifications
| Parameter | Part A | Part B |
|---|---|---|
| Appearance (Before Curing) | Grey Fluid | White Fluid |
| Viscosity at 25°C | 4500~5000 mPa·s | 4500~5000 mPa·s |
| Density at 25°C | 1.50±0.05 g/cm³ | 1.50±0.05 g/cm³ |
| Mixing Ratio (A:B) | 1:1 (Weight & Volume) | |
| Operating Time | 0.3-0.4 hr at 25°C | |
| Curing Condition | 4-12 hr at 25°C / 0.2 hr at 80°C | |
| Property (After Curing) | Value | Test Standard |
|---|---|---|
| Appearance | Grey Elastomer | Visual |
| Hardness | Shore A 50±5 | GB/T 531.1-2008 |
| Thermal Conductivity | ≥0.76 W/m·K | GB/T 10297-1998 |
| Volume Resistivity | ≥1.0*10¹⁶ Ω·cm | GB/T 1692-92 |
| Dielectric Strength | 18-25 kV/mm | GB/T 1693-2007 |
| Moisture Absorption (24h, 25°C) | 0.01-0.02% | GB/T 8810-2005 |
| Expansivity | 210 µm/(m·°C) | GB/T 20673-2006 |
| Temperature Resistance | -50 to +250°C | Measured |
| Flame Retardancy | UL 94 V-0 (3mm sample) | UL 94 |
Target Applications
Encapsulates IGBT modules in inverters, motor drives, and power converters. Low viscosity ensures complete under-fill beneath power semiconductor substrates.
Protects AC/DC charging station power modules from moisture, dust, and vibration in outdoor public charging infrastructure. UL 94 V-0 for built-environment safety.
Seals battery pack BMS boards, fast-charging adapters, and high-voltage transformers against environmental ingress and thermal cycling.
How to Use — Application Guide
- Surface Preparation: Clean the IGBT module or PCB substrate thoroughly. Ensure surfaces are free of oil, dust, and moisture for optimal adhesion.
- Mixing: Weigh Part A and Part B at 1:1 ratio. Mix thoroughly for 2-3 minutes with a clean stirring tool until uniform grey color is achieved.
- Vacuum Degassing (Recommended): For high-voltage IGBT modules, vacuum degas the mixed compound for 5-10 minutes to eliminate entrapped air bubbles.
- Potting: Pour the mixed compound slowly into the housing, allowing the low-viscosity material to flow around and under components. For large power modules, potting in stages is recommended.
- Curing: Room temperature cure: 4-12 hours. Heat-accelerated cure: approximately 12 minutes at 80°C for high-throughput production lines.
- Automated Production: Use a metering pump with static mixer for continuous dispensing. Pre-vacuum Part A and Part B separately before pumping for bubble-free results.
Packaging & Supply
Standard packaging: 20kg/drum and 200kg/drum with export-grade moisture-proof inner lining. MOQ: 20 kg. Monthly capacity: 50,000 kg from our 40,000 sqm manufacturing base in Guangdong, China. Shelf life: 6 months in cool, dry storage at room temperature. Non-toxic, non-dangerous goods shipped under general chemical handling. MSDS and TDS certificates provided with every order. Contact us for volume pricing, custom viscosity adjustments, and free evaluation samples.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.