Low Viscosity 2 Part RTV Silicone Potting Compound HN-8808AB Fast Room Temp Cure for Sensor Automotive ECU Protection
HN-8808AB is a low-viscosity condensation-cure RTV-2 silicone potting compound that delivers exceptional flowability into densely populated PCB assemblies and narrow sensor housings. Its 2000-2600 mPa·s mixed viscosity enables bubble-free penetration into tight clearances, while the fast 4-6 hour room temperature cure accelerates production cycles without requiring oven investment. Trusted for automotive ECU modules, industrial sensors, IGBT-based power converters, and IoT device encapsulation.
Mixed viscosity of 2000-2600 mPa·s ensures effortless self-leveling and complete penetration into fine-pitch component gaps, under BGAs, and around densely packed SMD components. Ideal for precision sensor modules and high-density automotive ECU PCB assemblies where void-free encapsulation is critical.
Full cure in just 4-6 hours at 25°C with no oven or external heating required. Reduces production bottlenecks, lowers energy costs, and eliminates thermal stress risks on temperature-sensitive components. 40-60 minute working time provides ample pot life for manual or automated dispensing operations.
Engineered for under-hood and in-cabin automotive electronic module protection. Withstands -50°C to 200°C thermal cycling, dampens vibration-induced solder joint fatigue, and provides corrosion-free protection for copper trace assemblies. Suitable for ECU, BMS, ADAS, and power distribution module encapsulation.
Volume resistivity exceeding 5.0×10¹⁴ Ω·cm and dielectric strength of ≥14 kV/mm deliver uncompromising electrical isolation for high-voltage sensor circuits, IGBT driver boards, and precision analog measurement modules. Dielectric constant ≤3.5 minimizes signal distortion in RF-sensitive applications.
The widely adopted 10:1 ratio format seamlessly integrates with standard twin-cartridge dispensers, static mixing nozzles, and automated meter-mix equipment. Ensures consistent ratio accuracy across high-volume production runs with minimal operator training required.
Condensation cure mechanism releases no acidic or corrosive by-products. Shore A 30-40 soft elastomer provides stress-relieving protection for sensitive wire bonds, MEMS sensors, and flexible PCBs. Low chemical shrinkage eliminates post-cure delamination under thermal cycling conditions.
| Application Field | Specific Use Case | Why HN-8808AB |
|---|---|---|
| Automotive ECU Modules | Engine ECU, transmission TCU, BMS, ABS controller, ADAS camera modules | -50°C~200°C range, vibration damping, non-corrosive, 14 kV/mm dielectric |
| Industrial Sensors | Pressure sensors, proximity sensors, Hall-effect sensors, temperature transducers | Low viscosity penetrates fine gaps, low dielectric constant for signal integrity |
| Power Converters & Inverters | IGBT module potting, DC-DC converter, solar micro-inverter, motor drive PCB | 5.0×10¹⁴ Ω·cm volume resistivity, 0.5 W/m·K heat dissipation |
| IoT & Wireless Devices | Outdoor IoT gateway, wireless sensor node, smart meter, GPS tracker | IP67-equivalent waterproofing, low-stress soft gel, wide temp range |
| Property | Component A | Component B |
|---|---|---|
| Appearance | Black liquid | Transparent liquid |
| Base Chemical Composition | Polysiloxane | Polysiloxane |
| Viscosity (cP) | 2000-2800 | 20-30 |
| Density (g/cm³) | 1.42±0.02 | -- |
| Property | Value |
|---|---|
| Mixed Viscosity | 2000-2600 mPa·s |
| Density | 1.40±0.02 g/cm³ |
| Operating Time at 25°C | 40-60 minutes |
| Curing Time at 25°C | 4-6 hours (fast RT cure) |
| Hardness | Shore A 30-40 |
| Volume Resistivity | ≥5.0×10¹⁴ Ω·cm |
| Thermal Conductivity | 0.5±0.1 W/m·K |
| Dielectric Strength | ≥14 kV/mm |
| Dielectric Constant | ≤3.5 |
| Elongation at Break | ≤100% |
| Temperature Range | -50°C to 200°C |
- Standard Packaging: 50kg/set (Component A 25kg + Component B 25kg) in sealed plastic drums
- Alternative Packaging: 40kg/set (Component A 20kg + Component B 20kg)
- Custom Packaging: Available for OEM/ODM customers — 1kg trial kits, 5kg pails, bulk drums
- Shelf Life: 6 months (best used within 3 months) when stored in a cool, dry place away from direct sunlight
- Transport: Non-dangerous goods classification. No special shipping documentation required
- Ensure PCB surfaces and component housings are clean, dry, and free from flux residue or oil contamination.
- Mix Component A and Component B at a 10:1 ratio by weight. Stir thoroughly until uniform color and consistency is achieved.
- Optional but recommended: Degas under vacuum (5-10 minutes at -0.1 MPa) to remove entrapped air for maximum dielectric integrity.
- Dispense into mold cavity or directly onto PCB assembly. The low 2000-2600 mPa·s viscosity enables gravity-assisted flow into fine clearances.
- Cure at ambient temperature (25°C) for 4-6 hours to reach full mechanical and electrical properties. No post-cure baking required.
- Do not heat-accelerate the condensation cure, as this may trap bubbles in the cured matrix. Use mixed material within the 40-60 minute pot life window.
Shenzhen Hanast operates a 40,000 m² production facility with dedicated R&D lab. We customize viscosity, hardness, thermal conductivity, and cure speed to your exact specifications. Sample formulations delivered in 3-5 working days. Full MSDS and TDS documentation provided with every batch.
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