Thermal Conductive Potting Compound 2.0W/m·K UL94 V-0 Two Component Silicone for New Energy Module Heat Dissipation
HN-8820 is a two-component addition-cure silicone potting compound engineered for high-performance thermal management in new energy applications. Delivering an exceptional thermal conductivity of 2.0 W/m·K and UL94 V-0 flame retardancy, it provides reliable encapsulation and heat dissipation for power electronics operating under demanding conditions. The convenient 1:1 mix ratio ensures simple processing in both manual and automated production lines.
- Outstanding Thermal Conductivity: 2.0 W/m·K — effectively transfers heat away from high-power components
- UL94 V-0 Flame Retardant: Meets the highest safety standards for electronic encapsulation
- Excellent Electrical Insulation: High volume resistivity (>5.0*10¹⁴ Ω·cm) ensures reliable isolation
- Broad Temperature Range: Stable performance from -40°C to 150°C for harsh environments
- 1:1 Mix Ratio: Simple processing with standard metering equipment; no complex ratio control required
- Waterproof & Moisture-Resistant: Provides long-term protection against humidity and environmental stress
- Anti-Aging Performance: Resistant to yellowing and thermal degradation over extended service life
- Low Viscosity (5000-8000 cP): Ensures complete filling of complex geometries and deep sections
- New Energy Power Modules: Ideal for encapsulating IGBT modules, MOSFET arrays, and power converters in EV and BESS systems where efficient heat dissipation is critical.
- Automotive Electronics: Protects ECUs, onboard chargers (OBC), DC-DC converters, and battery management systems (BMS) from thermal stress and vibration.
- Solar Inverters: Provides reliable thermal potting for photovoltaic inverter components exposed to outdoor temperature fluctuations and moisture.
- Network Transformers: Suitable for potting high-frequency transformers and inductors requiring combined thermal management and electrical insulation.
- LED Drivers: Extends service life of LED power supplies by efficiently dissipating heat and preventing moisture ingress.
- Sensor Modules: Encapsulates sensitive sensor electronics in industrial automation and IoT applications requiring environmental protection.
| Property | Value |
|---|---|
| Mix Ratio (A:B) | 1:1 |
| Viscosity | 5000-8000 cP |
| Thermal Conductivity | 2.0±0.1 W/m·K |
| Hardness | 45-55 Shore A |
| Volume Resistivity | >5.0*10¹⁴ Ω·cm |
| Flame Retardant | UL94 V-0 |
| Operating Time (25°C) | 1-2 Hours |
| Curing Time (25°C) | 2-4 Hours |
| Temperature Range | -40°C ~ 150°C |
| Shelf Life | 6 Months |
Standard Package: 50KG/Set (Part A: 25KG + Part B: 25KG). Custom packaging available upon request.
MOQ: 50 Kilograms.
Supply Capacity: 100 Tons per month with consistent batch-to-batch quality.
Delivery: 5-7 days for standard orders.
Certifications: ROHS, SGS, UL94 V-0 compliant. Full MSDS and TDS documentation provided with every shipment.
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