High Temperature RTV Silicone Potting Compound 10:1 Vibration Resistant for Automotive Electronic Module Encapsulation

High Temperature RTV Silicone Potting Compound for Automotive Electronics

HN-8808 is a two-part 10:1 RTV silicone potting compound designed for demanding electronic applications. It cures at room temperature into a tough yet elastic silicone elastomer that resists temperatures from -57°C to 250°C, dampens mechanical vibration and bonds firmly to circuit boards and housings, making it a reliable potting and encapsulation material for automotive electronic modules, power modules and outdoor electronics.

Key Features

• Wide Temperature Resistance: Stable elastomer performance from -57°C to 250°C, suitable for engine-adjacent and outdoor electronic enclosures.
• Vibration Dampening: Elastic cured silicone absorbs shock and mechanical vibration, protecting solder joints and sensitive components in moving vehicles.
• Strong Adhesion: Bonds firmly to PCB, metal and plastic housings with good adhesion and no corrosion of electronic parts.
• High Electrical Insulation: Dielectric strength ≥14 kV/mm and volume resistivity ≥5.0*10^14 Ω·cm provide reliable insulation for high-voltage modules.
• Waterproof & Moisture-Proof: Seals modules against water, humidity and dust for long-term outdoor reliability.
• Safe Curing Profile: 40-60 minutes operating time and 4-6 hours cure at 25°C with no heat release, non-toxic, odorless and non-swelling.
• Simple 10:1 Mixing: Low-error mix ratio and good flowability for potting compact electronic modules.
• Certified Materials: RoHS and SGS compliant for global export.

Typical Physical Properties

• Appearance: Transparent flowing liquid (Part A & Part B)
• Mix Ratio: A:B = 10:1 by weight
• Viscosity (25°C): Part A 2000 mPa·s; Part B 50 mPa·s
• Density: 1.40-1.42 g/cm³ after mixing
• Operating Time (25°C): 40-60 minutes
• Curing Time (25°C): 4-6 hours
• Hardness: 25 Shore A
• Dielectric Strength: ≥14 kV/mm
• Volume Resistivity: ≥5.0*10^14 Ω·cm
• Temperature Range: -57°C to 250°C
• Thermal Conductivity: 0.1-0.20 W/m·K

Applications

• Automotive electronic modules and control units
• Power modules and switching power supplies
• Circuit board encapsulation for vibration environments
• LED drivers and outdoor electronic devices

Packaging & Supply

Available in 25 kg/iron drum or A+B set packing with MSDS and TDS documentation. ODM and OEM services welcome. Contact our technical team for samples and specifications.