Thermally Conductive Silicone Encapsulant 2.0W/mK UL94 V-0 Fast Heat Cure Potting Gel for Motor Drive BMS Protection

HN-8820 AB is a two-component 1:1 thermally conductive silicone encapsulant engineered for motor drive controllers, battery management systems (BMS) and RF modules. With 2.0 W/m·K thermal conductivity, UL94 V-0 flame retardancy and an optional fast heat cure of 10-20 minutes at 80℃, it delivers high-throughput potting with reliable thermal management and environmental protection.

• 2.0 W/m·K Thermal Conductivity — efficient heat dissipation for high-power motor drives and power electronics.
• Fast Heat Cure (80℃) — cures in 10-20 minutes at 80℃, accelerating production throughput; 2-4 h at 25℃ for room-temperature curing.
• UL94 V-0 Flame Retardant — meets stringent fire-safety standards for automotive and industrial electronics.
• Excellent Substrate Adhesion — strong bonding to most substrates, protecting PCBs, IGBTs and inductors from vibration and moisture.
• 1:1 Mix Ratio, Easy Dispensing — 45-50 Shore A soft elastomer with 60-120 min pot life for reliable automated potting.
• Wide Temperature Range — stable from -40℃ to 150℃.

• Motor drive controllers and inverters
• Battery management system (BMS) modules
• RF modules and communication power amplifiers
• IGBT power modules and sensors
• Industrial power supplies and new energy electronics