Low Modulus Dielectric Silicone Gel 1:1 Transparent Self Healing for IGBT Power Module Encapsulation

Low Modulus Dielectric Silicone Gel for IGBT Power Module Encapsulation

HN-6607 A/B is a two-component, 1:1 addition-cure silicone gel formulated with an ultra-low modulus and high dielectric strength for stress-free encapsulation of IGBT power modules, power electronics and other sensitive circuitry. The transparent, self-healing jelly remains flexible over the full service life and protects delicate solder joints, bond wires and sensors from mechanical and thermal stress.

Key Benefits

• Low Modulus, Ultra Soft (Shore A 0-10): Applies virtually zero stress on IGBT dies, bond wires and delicate components, preventing cracking and delamination.
• High Dielectric Strength: Stable electrical insulation for power electronics working under high voltage and switching stress.
• Self-Healing Jelly: Needle-pierced gel re-seals after withdrawal, preserving waterproof and insulation integrity for reliable long-term operation.
• Self-Adhesion: Bonds to most substrates without primers, simplifying potting lines.
• Exceptional Transparency: Colorless after curing for easy visual inspection and optical coupling of internal components.
• Wide Temperature Stability: Reliable from -50°C to +200°C for demanding industrial and automotive power electronics.

Applications

• IGBT power module and power electronics encapsulation
• Dielectric potting of high-voltage and switching circuits
• Load cell, waterproof scale and PCB encapsulation
• Weighing sensor and transducer protection
• Junction box sealing and LED / optoelectronic module packaging

Typical Physical Properties

Packaging & Supply

Available in 20 kg and 200 kg drums with MSDS and TDS documentation. Non-dangerous goods, transportable as general chemicals. OEM and custom formulations welcome. Contact our technical team for details.