Medium Temperature Cure Silicone Gel 1:1 Fast Vulcanization for High Volume Electronic Potting

Medium Temperature Cure Silicone Gel with Fast Vulcanization for High-Volume Electronic Potting

HN-6607 A/B is a two-component, 1:1 addition-cure silicone gel engineered for medium-temperature fast vulcanization. It combines a long pot life with a short curing cycle, helping electronics manufacturers optimize process layout, reduce energy consumption and boost production productivity. After curing it forms an ultra-soft, transparent gel with stable dielectric performance.

Key Benefits

• Fast Vulcanization: Medium-temperature accelerated cure shortens cycle time and raises output.
• Wide Process Window: Long pot life paired with short curing time optimizes process layout.
• Stable Performance: Consistent post-cure properties for reliable potting.
• High Versatility: Suitable for potting a wide range of electronic components.
• Ultra Soft (Shore A 0-10): Low-stress protection for delicate circuits.
• High Insulation: Dielectric strength 2.8-3.2 kV/mm; wide -50°C to +200°C range.

Applications

• High-volume production of automotive electronic modules
• Potting for consumer electronics requiring fast turnaround
• Protection for industrial control boards
• Waterproof sealing for connectors and terminals
• PCB encapsulation and sensor protection

Typical Physical Properties

Operation Guide

Stir Part A thoroughly and shake Part B well. Weigh and mix at 1:1 by weight until uniform, then pot or dispense. Cure in a preheated oven at 120°C for 20-30 minutes, or accelerate at 60-80°C medium temperature; room-temperature cure is possible.

Packaging & Supply

Available in 20 kg and 200 kg drums with MSDS and TDS documentation. OEM and custom formulations welcome. Contact our technical team for details.