Two Component Silicone Potting Compound 4.0 W/mK Photovoltaic Energy Storage Power Equipment UL94 V-0
Ultra-High Thermal Conductivity Silicone Potting Compound (4.0 W/m·K)
This two-component, addition-cure (platinum-catalysed) silicone potting compound delivers an ultra-high thermal conductivity of 4.0±0.1 W/m·K, purpose-built for high-power electronic components with demanding heat dissipation and temperature resistance requirements. It is especially suited to photovoltaic and energy storage power equipment.
Key Features
- Ultra-high thermal conductivity: 4.0±0.1 W/m·K for superior heat transfer in high-power modules
- Wide operating temperature range: −40°C to 200°C, maintaining rubber elasticity after cure
- UL94 V-0 flame retardancy for enhanced safety in electronic assemblies
- Excellent electrical insulation: volume resistivity ≥1.0×1014 Ω·cm
- 1:1 mix ratio by weight with good fluidity and self-levelling behaviour
- Flexible curing: room-temperature cure or heat-accelerated cure (80°C / 30 min)
Typical Applications
- Photovoltaic modules and junction boxes, inverters and combiner boxes
- Energy storage power equipment, battery packs and BMS power modules
- Potting and protection of high-power power modules and circuit boards
- Switching power supplies and driver power supplies
- Automotive HID lamp power modules and automotive ignition system power modules
- Home appliance controllers and new energy vehicle DC-DC converters
Technical Data (Cured Properties)
| Property | Unit | Value |
|---|---|---|
| Mix Ratio (A:B) | by weight | 1:1 |
| Mixed Viscosity (25°C) | mPa·s | 13000±2000 |
| Mixed Density (25°C) | g/cm³ | 2.95±0.02 |
| Pot Life / Operating Time (25°C) | min | 60–180 |
| Cure Time (Room Temp.) | h | 4–8 |
| Cure Time (Heat Accelerated, 80°C) | min | 30 |
| Hardness | Shore A | 45±8 |
| Thermal Conductivity | W/m·K | 4.0±0.1 |
| Volume Resistivity | Ω·cm | ≥1.0×1014 |
| Flame Retardancy | UL94 | V-0 |
| Operating Temperature Range | °C | −40 to 200 |
Mixing & Application
- Pre-mix: Stir Component A thoroughly (fillers may settle). Shake or stir Component B to ensure homogeneity.
- Weighing: Accurately weigh A and B per the 1:1 ratio by weight (not by volume) using a precision scale.
- Mixing: Mix thoroughly until uniform in colour; scrape container walls and bottom.
- Degassing (optional): Vacuum-degas for void-sensitive applications.
- Pouring / Potting: Pour within pot life and ensure complete coverage without trapped air.
- Curing: Cure at room temperature (4–8 h) or heat-accelerated (80°C / 30 min).
Packaging & Storage
- Component A: 25 kg plastic barrel | Component B: 25 kg plastic barrel | Kit (A+B): 50 kg/set
- Store in original, tightly sealed containers in a cool, dry, well-ventilated area (5–25°C). Protect from direct sunlight and moisture.
- Shelf life: 6 months from date of manufacture when stored as recommended.
Precautions
For industrial/professional use only. Wear nitrile gloves, safety goggles and protective clothing; avoid skin and eye contact and ensure adequate ventilation. Do not use in contact with condensation-cure (acetoxy) silicone, epoxy resin or polyurethane, and keep substrates free of sulfur, tin, amine, phosphorus and acidic contaminants to avoid cure inhibition.
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