4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
4-Layer PCB Motherboard for Mobile Communication Devices
This product is specifically designed for communication mobile phones, aiming to provide a stable and reliable user experience as well as efficient application solutions.
Key Specifications
| Layer Count | 4 |
| Material | FR4 TG170 |
| Board Thickness | 1.2 mm |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Application Field | Mobile phone communication |
Product Features
- 4-Layer Precision Impedance Design ensures optimized and stable signal transmission
- All buttons adopt ENIG (Immersion Gold) process for improved sensitivity and durability
- Comprehensive Quality Control System covering various rigorous inspections and electrical functional testing
- Communication-Grade Design guarantees smooth and stable daily use
- PCB Solutions tailored specifically for the communication handset sector
We provide one-stop PCB solutions for the communication field, integrating material grading, precision manufacturing, full-process inspection, and environmental adaptability to meet long-term stable operation requirements.
Advantages of Custom PCB Solutions
- Highly Customizable: Supports customization of dimensions, thickness, layer count, and various functional requirements to flexibly meet diverse application needs
- High-Performance Materials: Utilizes FR-4 and medium-to-high TG materials, offering excellent heat resistance, moisture resistance, and long-term stability
- Superior Reliability: Features high dielectric strength, robust voltage withstand capability, and excellent anti-interference performance, ensuring stable operation even in harsh environments
- Professional Surface Finishes: Provides options such as ENIG, lead-free HASL, and OSP to ensure excellent solderability and long-term reliability
Technical Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia