Tg175℃ FR-4 Multilayer Printed Circuit Board 8 Layer PCB With Immersion Gold
Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold
| Layer Count | 8 Layers |
| Material | FR-4 |
| Board Thickness | 1.6 Mm |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Green |
| Surface Finish | Lead-Free HASL (Tin Spray) |
| Application Field |
Industrial Control and Automation Systems |
Our 8-layer multilayer printed circuit boards are manufactured using high TG175℃ FR-4 substrate with Immersion Gold (ENIG) surface finish. The TG175℃ high glass transition temperature laminate delivers outstanding thermal resistance and low thermal expansion coefficient, effectively preventing delamination, layer separation and via barrel cracking during multiple lead-free reflow cycles.
The 8-layer stack-up design realizes reasonable separation of power layers, ground layers and signal layers, which helps reduce crosstalk, enhance EMI shielding and support high-density, high-speed circuit layout. Immersion gold treatment provides flat, oxidation-resistant pads with stable solderability, ideal for soldering BGA, QFN and fine-pitch semiconductor components.
Customized layer stack-up, controlled impedance, blind/buried vias, board thickness and outline are available according to customer Gerber data. All production complies with IPC-A-600 standards, UL and RoHS requirements. These PCBs are widely adopted in industrial automation equipment, communication equipment, test instruments, automotive electronics and medical control modules. Prototype samples and mass-volume production orders are both acceptable.
Key Manufacturing Features
1.8-layer multilayer PCB constructed with TG175℃ high-Tg FR-4 base material
2.High thermal stability, withstand repeated lead-free SMT reflow soldering processes
3.Low Z-axis CTE, greatly lower risks of hole crack and board delamination
4.Immersion Gold (ENIG) surface finish for excellent oxidation resistance and consistent solderability
5.Rational 8-layer stack-up layout, convenient for signal, power and ground layer partition
6.Good electromagnetic shielding performance to suppress signal interference and noise
7.Support controlled impedance, blind & buried vias, HDI high-density wiring design
8.Less board warpage, highly compatible with automatic high-speed SMT assembly
9.Multiple solder mask color options: green, black, white, blue, red upon request
10.Fully RoHS compliant, UL certification can be supplied on demand
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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