12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
12 Layer Multilayer HDI PCB with Stacked Blind Vias for High-Density Electronics
The manufacturing process focuses on precise dual-laser alignment control. First- and second-stage blind vias are formed through sequential laser drilling, with cumulative microvia offset maintained within ≤25μm. Each laser drilling system is monitored through Statistical Process Control, maintaining a process capability index (CPK) of ≥1.33 to ensure consistent production quality.
To optimize black solder mask performance, exposure energy grid testing is conducted before production. The process ensures complete development and eliminates residue inside blind vias, preventing reliability issues during assembly.
Key Specifications
| Layer Count | 12-Layer |
| Material | FR-4 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 2/1/1/1/1/1/1/1/1/1/1/2 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Black |
| Surface Finish | OSP |
Product Description
Advanced 2+N+2 HDI Structure
- Two-step HDI architecture with stacked laser microvias.
- Higher routing density for complex multilayer designs.
- Supports miniaturized and high-performance electronic products.
Precision Dual-Laser Alignment Control
- Sequential laser drilling process for stacked blind vias.
- Cumulative blind-via offset controlled within ≤25μm.
- Improves interconnection reliability and electrical performance.
High Process Capability Manufacturing
- Laser drilling equipment maintained at CPK ≥1.33.
- Stable production consistency across volume manufacturing.
- Reduced variation and improved yield rates.
Black Solder Mask Optimization
- Professional exposure energy grid testing before production.
- Enhanced process control for black solder resist applications.
- Suitable for high-density circuit patterns and fine-pitch designs.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia