10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision Electronics
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
10 Layer High-Density Interconnect PCB with Blue Solder Resist for Precision Electronics
Custom 10 Layer 1+N+1 HDI PCB with Blue Solder Mask and ENIG Finish is engineered for high-density electronic applications requiring reliable blind-via interconnections, excellent solderability, and superior manufacturing consistency. Featuring a 10-layer stack-up combined with first-order HDI technology, the PCB provides enhanced routing capability and optimized signal integrity for advanced electronic devices.
Key Specifications
| Layer Count | 10-Layer |
| Material | FR-4 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Blue |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
10-Layer 1+N+1 HDI Structure
- Advanced multilayer PCB design with first-order HDI technology.
- Optimized routing density and signal transmission performance.
- Suitable for compact, high-performance electronic products.
High Blind-Via Yield Control
- Laser-drilled blind vias with strict process management.
- No stub residue permitted at blind-via bottoms.
- Ensures stable electrical connectivity and long-term reliability.
Advanced Desmear Process
- Complete resin removal after laser drilling.
- Backlight inspection grade ≥ Level 9.
- Improves metallization quality and via reliability.
Premium Blue Solder Mask Technology
- Industry-standard blue solder resist with excellent appearance.
- Optimized for fine-line circuit manufacturing.
- Provides strong environmental and chemical resistance.
Low-Viscosity Ink Process
- Special low-viscosity solder mask formulation.
- Enhanced coating uniformity across high-density structures.
- Reduces risk of incomplete development.
Precision Screen Printing Control
- Printing pressure maintained between 4–6 kg/cm².
- Prevents ink penetration into microvias and drilled holes.
- Ensures accurate solder mask definition.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia