24 Layer FR4 High Frequency PCB Board 2.5mm With Immersion Gold Surface
24 Layer FR4 High Frequency PCB Board 2.5mm Immersion Gold Surface For Mobile
This 24-layer FR4 high frequency PCB with 2.5mm overall thickness and immersion gold surface finish is specially designed for mobile communication equipment. It adopts high-Tg low-loss FR4 dielectric material to balance excellent high-frequency signal performance and cost advantage. Rigorous multilayer lamination process ensures stable layer alignment and reliable interlayer conduction. Immersion gold surface delivers flat soldering pads, good oxidation resistance and outstanding bonding performance for IC, RF components and BGA chips. Strict controlled impedance is implemented to maintain signal integrity during high-speed data and RF transmission. Widely used in mobile terminal communication mainboards, communication modules, handheld wireless devices and related mobile electronics.
| Layer Count | 24-Layer |
| Material | Fr4 |
| Board Thickness | 2.5 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | Lead-free Soldering |
Product Description
1.24-layer multilayer structure, finished board thickness: 2.5mm, stable mechanical structure
2.High frequency low loss FR4 substrate, suitable for mobile communication high-speed signal transmission
3.Precise layer alignment & advanced lamination technology, minimal interlayer displacement
4.Professional controlled impedance capability, effectively reduce high-frequency signal crosstalk and attenuation
5.Good thermal resistance and high Tg property, withstand multiple SMT reflow processes
6.Stable dimensional stability, less warpage after processing
7.Excellent electrical insulation performance, consistent batch production quality
8.Suitable for assembling BGA, QFN and various miniature communication chips
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.