2 Step HDI Communication PCB Immersion Gold 8 Layer PCB Manufacturer
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
Key Specifications
| Layer Count | 8-Layer |
| Material | FR4 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.05 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Used in the communication field. |
Product Description:
Product Name: HDI Printed Circuit Board Material: FR-4 Copper Thickness: 1/2 oz Layer Count: 8 layers Lead Time: 12-15 days Minimum Silkscreen Gap: 0.15 mm, ensuring precise and accurate design
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia