6 Layer Embedded Control Multilayer PCB Board With Immersion Gold
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
6-layer immersion gold embedded control PCB board
Key Specifications
| Layer Count | 6 |
| Material | FR4 TG150 |
| Board Thickness | 1.6mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm three sides |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.12 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Embedded Control Product |
Product Description:
Lamination & Material Selection
| Focus Area | Specific Requirements |
|---|---|
| Substrate | High-Tg FR-4 (Tg ≥ 150°C, 170°C recommended), low moisture absorption, good heat resistance |
| Copper Foil Thickness | Signal layer: 0.5oz ~ 1oz; Power/GND layer: 1oz ~ 2oz; High-current paths: ≥ 2oz |
| Lamination Symmetry | Multilayer stack-up must be symmetrical to prevent board warpage |
Design for Manufacturing (DFM)
| Focus Area | Recommended Design Value | Typical Minimum Capability |
|---|---|---|
| Trace Width/Spacing | ≥ 6mil | 4mil |
| Via Hole Diameter | 0.3mm (signal), 0.4~0.5mm (power) | 0.2mm (laser), 0.3mm (mechanical) |
| Pad Size | 0.1~0.2mm wider than pin | — |
| Silkscreen | Line width ≥ 5mil, keep clear of pads and vias | — |
| Test Points | Reserve on critical signals and power nets; spacing ≥ 1.27mm |
Technical Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Get in Touch
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia