6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
6-layer ENIG Communication Equipment Module
This high-performance 6-layer communication module is engineered for wireless base station applications, featuring advanced manufacturing processes and strict quality controls to ensure reliable high-frequency signal transmission.
Key Specifications
| Layer Count | 6 Layers |
| Material | FR4 TG150 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/0.5/0.5/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.12mm |
| Minimum Line Spacing | 0.12mm |
| Solder Mask Color | White |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Application Field | Communication Module |
Manufacturing Process Highlights
- LDI Pattern Transfer: Laser Direct Imaging ensures ±10% line width tolerance control
- Vacuum Lamination: Eliminates dry film bubbles during production
- AOI Inspection: Automated Optical Inspection detects undercuts and shorts post-etching
- Precision Lamination: Controlled temperature ramp rate (1.5-2.5°C/min) prevents glass fiber slippage
- Advanced Drilling: Coated drill bits with backup board structures minimize hole wall burrs
- ENIG Finish: Plasma cleaning and micro-etching with nickel (3-6μm) and gold (0.05-0.1μm) layer control
- 100% Electrical Testing: Flying probe or universal fixture testing ensures opens/shorts detection
Technical Capabilities
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia