FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
6-layer ENIG Blue Mobile Phone Module
This advanced 6-layer mobile phone module features ENIG surface finish and blue solder mask, specifically designed for mobile communication applications with high-frequency performance requirements.
Key Specifications
| Specification | Value |
|---|---|
| Layer Count | 6 Layers |
| Material | FR4 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Blue |
| Surface Finish | ENIG |
| Application Field | Mobile Communication |
Critical Production Processes
- Inner layer core board undergoes browning treatment for uniform film density
- CCD automatic alignment exposure with ±25μm interlayer accuracy
- 100% AOI inspection and line width measurement after inner layer etching
- Hot oil press lamination with ±2°C temperature uniformity and vacuum assist
- X-Ray measurement with ≤75μm interlayer misalignment control
- Scanning acoustic microscopy for delamination and void detection
- High-precision CNC drilling with backup board structures
- Desmearing and potassium permanganate treatment before electroless copper
- Vacuum screen printer for solder mask application
- Plasma roughening before ENIG for enhanced adhesion
- Comprehensive testing including tape pull, bend testing, and TDR impedance
Technical Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia