8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
8-layer OSP Black Communication Module
High-performance 8-layer communication module featuring OSP surface finish and black solder mask, designed for reliable operation in communication applications.
Key Specifications
| Parameter | Specification |
|---|---|
| Layer Count | 8 Layers |
| Material | FR4 TG150 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/0.5/0.5/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.12mm |
| Minimum Line Spacing | 0.12mm |
| Solder Mask Color | Black |
| Surface Finish | OSP |
| Application Field | Communication Module |
Critical Production Processes
- Vacuum lamination technology for inner layer pattern transfer to ensure tight adhesion and prevent bubble generation
- Automated Optical Inspection (AOI) after inner layer etching to detect defects including undercuts, pinholes, and shorts
- Strict control of temperature ramp rate (1.5-2.5°C/min) and pressure profile during lamination to prevent delamination
- Coated drill bits for drilling process to reduce hole wall burrs, followed by desmearing and potassium permanganate cleaning
- Plasma treatment before electroless copper deposition to improve hole wall roughness and adhesion
- Backlight testing after copper deposition to ensure quality
- Board brushing and sandblasting before solder mask spraying to improve ink adhesion
- Parallel light exposure machine for solder mask exposure with energy uniformity ≥85%
- Micro-etch roughening treatment before lead-free HASL with micro-etch depth of 1.5-2.5μm
- Board baking (120°C/1h) to remove moisture and prevent solder splash
- Controlled vertical board withdrawal speed during HASL for uniform tin layer thickness (±5μm)
- Cooling and flattening after HASL with warpage inspection (≤0.75%)
- 100% electrical testing using flying probe or universal fixture testing
Technical Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia