6 Layer Medical Equipment PCB FR4 TG150 1.6mm Thickness ENIG Printed Circuit Board
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
6-layer ENIG Medical Equipment Control
6-layer ENIG medical equipment control board designed for high-reliability medical device applications.
Key Specifications
| Layer Count | 6 Layers |
| Material | FR4 TG150 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.25mm |
| Minimum Line Width | 0.2mm |
| Minimum Line Spacing | 0.18mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Medical Device Control |
Critical Production Processes
Material and Design Selection
- High-Tg (≥150°C) or BT resin materials must be selected to ensure long-term heat resistance and moisture resistance
- ENIG surface finish is preferred, with nickel layer thickness of 3-6μm and gold layer thickness of 0.05-0.1μm to avoid "black pad" risk
- Trace width/spacing should be controlled at 0.1-0.15mm, with characteristic impedance deviation stricter than ±8%
Key Production Process Controls
- Drilling and Hole Metallization: Coated drill bits must be used to reduce hole wall burrs. After desmearing, backlight testing (≥Grade 9) is required to ensure hole walls are free of cracks
- Pattern Transfer and Etching: LDI exposure equipment should be used, with line width tolerance of ±10%. After etching, 100% AOI inspection must be performed to screen out undercuts and shorts
- Lamination and Flatness: Symmetrical stack-up design is required, with post-lamination warpage ≤0.5% to prevent SMT soldering defects such as insufficient solder or open joints
- Solder Mask and Surface Finish: Solder mask ink must be resistant to chemical cleaning (e.g., IPA), with no residue after development. Before ENIG, plasma cleaning must be performed, with ionic contamination ≤1.5μg/cm²
Reliability Verification
- Each batch must undergo solderability testing, high-temperature high-humidity testing (85°C/85% RH, 168 hours), and temperature cycling testing (-40°C to 85°C, 100 cycles) to ensure long-term electrical stability in sterile environments
Technical Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia